JPH0365896B2 - - Google Patents
Info
- Publication number
- JPH0365896B2 JPH0365896B2 JP22931585A JP22931585A JPH0365896B2 JP H0365896 B2 JPH0365896 B2 JP H0365896B2 JP 22931585 A JP22931585 A JP 22931585A JP 22931585 A JP22931585 A JP 22931585A JP H0365896 B2 JPH0365896 B2 JP H0365896B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- metal
- metal conductor
- hybrid integrated
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1617—Cavity coating
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22931585A JPS6286841A (ja) | 1985-10-14 | 1985-10-14 | 高周波混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22931585A JPS6286841A (ja) | 1985-10-14 | 1985-10-14 | 高周波混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6286841A JPS6286841A (ja) | 1987-04-21 |
| JPH0365896B2 true JPH0365896B2 (en]) | 1991-10-15 |
Family
ID=16890211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22931585A Granted JPS6286841A (ja) | 1985-10-14 | 1985-10-14 | 高周波混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286841A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010137592A1 (ja) | 2009-05-26 | 2010-12-02 | 株式会社インキュベーション・アライアンス | 炭素材料及びその製造方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI915242L (fi) * | 1991-11-06 | 1993-05-07 | Nokia Mobile Phones Ltd | Rf-skaermning av kretskort |
| JP2854757B2 (ja) * | 1992-06-17 | 1999-02-03 | 三菱電機株式会社 | 半導体パワーモジュール |
| JP2577088Y2 (ja) * | 1993-03-29 | 1998-07-23 | 京セラ株式会社 | 半導体素子収納用パッケージ |
| DE29514398U1 (de) * | 1995-09-07 | 1995-10-19 | Siemens AG, 80333 München | Abschirmung für Flachbaugruppen |
| US5761053A (en) * | 1996-05-08 | 1998-06-02 | W. L. Gore & Associates, Inc. | Faraday cage |
| DE19715663C2 (de) * | 1997-04-16 | 2000-03-30 | Daimlerchrysler Aerospace Ag | Gehäuse für elektronische Bauelemente |
| JP5959497B2 (ja) * | 2013-12-25 | 2016-08-02 | 株式会社東芝 | 半導体パッケージ |
| KR20150075347A (ko) | 2013-12-25 | 2015-07-03 | 가부시끼가이샤 도시바 | 반도체 패키지, 반도체 모듈 및 반도체 디바이스 |
| JP2015126025A (ja) * | 2013-12-25 | 2015-07-06 | 株式会社東芝 | 半導体パッケージ |
| JP2015149649A (ja) | 2014-02-07 | 2015-08-20 | 株式会社東芝 | ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置 |
| JP2015149650A (ja) | 2014-02-07 | 2015-08-20 | 株式会社東芝 | ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置 |
-
1985
- 1985-10-14 JP JP22931585A patent/JPS6286841A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010137592A1 (ja) | 2009-05-26 | 2010-12-02 | 株式会社インキュベーション・アライアンス | 炭素材料及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6286841A (ja) | 1987-04-21 |
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